The core problem: At DC and low frequencies, lumped components behave as their label says. But at RF, every component has parasitic inductance, capacitance and resistance that change its impedance completely. A capacitor can look like an inductor. An inductor can look like a capacitor. A resistor can resonate. Understanding this is fundamental to any RF design above ~50 MHz.
C
Real Capacitor
Equivalent Circuit & SRF
P1 ESL ESR C P2 Rp ESL=parasitic inductance · ESR=series resistance · Rp=leakage
SRF = 1/(2π√(ESL·C))
Q at SRF = —
C (nominal) 10 nF
ESL (parasitic inductance) 5 nH
ESR (series resistance) 0.1 Ω
|Z| actual
Ideal 1/ωC
SRF point
Below SRF: acts capacitive (|Z| falls with frequency).
At SRF: ESL resonates with C → |Z| = ESR (minimum, purely resistive).
Above SRF: acts inductive — your capacitor is now an inductor!
L
Real Inductor
Equivalent Circuit & SRF
P1 DCR L Cp P2 DCR=winding resistance · L=inductance · Cp=inter-winding capacitance
SRF = 1/(2π√(L·Cp))
Q peak = —
L (nominal) 10 nH
Cp (inter-winding capacitance) 0.5 pF
DCR (winding resistance) 0.5 Ω
|Z| actual
Ideal ωL
SRF point
Below SRF: acts inductive (|Z| rises with frequency, Q peaks).
At SRF: Cp resonates with L → |Z| = DCR (maximum, purely resistive).
Above SRF: acts capacitive — your inductor is now a capacitor!
R
Real Resistor
Equivalent Circuit & Behaviour
P1 L_lead R L_lead P2 Cp L_lead=lead inductance · R=body resistance · Cp=body capacitance
Resonance = —
Q at 100MHz = —
R (nominal) 50 Ω
L_lead (lead inductance) 2 nH
Cp (body capacitance) 0.2 pF
|Z| actual
Ideal R
Resonant point
Low frequency: |Z| ≈ R as expected.
At resonance: lead inductance resonates with Cp → impedance peaks or dips.
High frequency: Cp dominates → resistor looks like a short circuit!
What is Self-Resonant Frequency (SRF)?
SRF Definition: The frequency at which a component's parasitic reactance exactly cancels its intended reactance. At SRF, the component looks purely resistive.

For a capacitor: f_SRF = 1/(2π√(ESL·C))
For an inductor: f_SRF = 1/(2π√(L·Cp))

Rule of thumb: Never use a component above 50% of its SRF. Above SRF it behaves as the opposite component type.
Practical implication: A 100 nF decoupling capacitor with 3 nH ESL has SRF ≈ 9 MHz. At 100 MHz it looks like a 3 nH inductor — completely useless for decoupling. This is why RF decoupling uses multiple capacitors in parallel (different SRFs stagger across the band).
Typical SRF Values
ComponentValueTypical SRFUsable to
SMD Cap (0402)100 nF~9 MHz4 MHz
SMD Cap (0402)10 nF~30 MHz15 MHz
SMD Cap (0402)100 pF~300 MHz150 MHz
SMD Cap (0402)1 pF~3 GHz1.5 GHz
SMD Inductor100 nH~100 MHz50 MHz
SMD Inductor10 nH~500 MHz250 MHz
SMD Inductor1 nH~3 GHz1.5 GHz
Resistor (0402)50 Ω~1 GHz500 MHz
Resistor (0402)1 kΩ~200 MHz100 MHz
RF Design Rules for Lumped Components
1. Always check SRF in datasheets
RF component datasheets specify SRF. Never use a component above 50% of its SRF in a signal path.
2. Smaller package = higher SRF
0201 > 0402 > 0603 for SRF. Smaller packages have less lead inductance and less parasitic capacitance.
3. Parallel decoupling caps
Use 100 nF ∥ 10 nF ∥ 100 pF ∥ 1 pF in parallel to cover a wide frequency range. Each handles a different band.
4. High-value resistors are capacitive at RF
A 10 kΩ resistor has significant body capacitance. At GHz frequencies it looks like a short. Use resistor dividers carefully in RF feedback paths.
5. Bond wire and via inductance matters
A 1 mm bond wire ≈ 1 nH. A PCB via ≈ 0.3–1 nH. At 5 GHz, 1 nH = 31 Ω reactance — significant in matching networks.
6. Use transmission line elements instead
Above ~2–3 GHz, replace lumped L and C with microstrip stubs, coupled lines and λ/4 sections which have predictable distributed behaviour.